Cable Connector Enhancement

STTR · Phase: BOTH · Topic DME26TZ05-NP001 · Solicitation 26.TZ

It is widely known that the cable to board connection is a common failure prone interface for electronics systems due to the thermal and mechanical stress they are exposed to. For new designs this connection can be engineered such that risk is lowered as much as reasonably possible but for existing design, there are limited options to overcome the difficulty of maintaining a strong reliable electrical connection in stressful environments. Potting PCBA and electronics assemblies offer great moisture, vibration and shock protection but when potting connectors the potting material is limited to the height of the connector below the electrical contact to prevent potting material from disrupting the connection between each end [3]. This ensures the board side of the connector is secure but not the full connection joint. That connection is still easily severed if it is strained beyond its mechanical limits, which for commercial grade connectors are a relatively low threshold. Commercial connectors could be swapped with more specialized connectors if they exist and the pad footprint on the board is still sufficient but removal of existing connectors from PCBAs still require considerable time for technicians. Reworking existing boards for the purpose of swapping the connector adds additional risk of board fallout from damage or thermal cycling. Repeated use of heat guns for removing and replacing a new connector or cable solution can degrade the heat affected zone and reduce reliability of the board and neighboring components. Especially for densely populated boards with limited distance from a connector to neighboring components which may prevent the use of a heat shield due to limited space. A heat shield can typically be used to avoid thermal and mechanical damage to adjacent components on a PCBA [4] Other options have the connector removed entirely in favor of a direct solder connection, be the board to cable or board to board. Alternative joining methods to replace the connector connection such as Hot Bar Soldering (HBS) can be cumbersome in both time and resources for small production efforts for any singular design. HBS uses pulse heated to reflow the solder material between a PCBA and the wire to form a strong junction [1]. The Hot Bar Solder (HBS) process for any given design requires tooling, fixturing and a compatible Anisotropic Conductive Film (ACF); the space between conductors, minimum pad area, the plating and substrates involved. For an existing connector footprint within a design compatible ACF may not exist and may not be able to be sourced in reasonable quantities as ACF is commonly sold by the case. While recent advancement exists for mitigating use of ACF [2] other challenges remain with design the tooling and the rework required to remove existing connectors. The design of the tool shape is critically important to the temperature distribution across the reflow area and has significant impact on the resultant mechanical and electrical properties achieved [1]. Tooling design and fabrication iterations increase schedule requirements for assembly efforts with increasing difficulty for adequate tooling shape on densely populated boards. These different paths or full board redesign and fabrication are expensive, time consuming and limited solutions because they are assembly specific. To enhance prototyping and system integration efforts a more versatile and efficient solution is needed to address this deficiency.

SBIR/STTR 은 미국 중소기업만 지원할 수 있습니다(Small Business Act 법정 요건). • 계열사를 포함해 상시 종업원 500명 이하 • 미국 시민 또는 영주권자 1인 이상이 50%를 초과해 직접 소유·지배 • 미국 내 사업장을 두고 주로 미국 내에서 사업을 영위할 것 • 수행책임자(PI)의 주된 근무처가 신청 기업일 것 출처: https://www.sbir.gov/faq/eligibility-requirements

주 대상 국가

🇺🇸 미국

추가 적격 국가

없음

해외기업 지원

불가

현지 법인

필수

지역 조건

미국 내 사업장을 두고 미국 시민·영주권자가 50%를 초과해 소유한 중소기업만 신청할 수 있습니다(법정 요건).

제출서류 정보가 수집되지 않았습니다 (확인 필요). 공식 공고문에서 직접 확인하세요.

신청 절차 정보가 확인되지 않았습니다.

평가 절차 정보가 확인되지 않았습니다.

신청 절차 정보가 확인되지 않았습니다.

생성: local:rules-v1 · 3시간 전

요구 제출자료가 공고에서 확인되지 않아 기술 공개 범위를 판정할 수 없습니다. 요구 자료 범위가 확인되지 않았습니다. 운영주체는 U.S. Department of War — DMEA입니다. 미확인 항목 8건은 공고문·협약서에서 직접 확인이 필요합니다.

이 분석은 저장된 공고·서류·계약 조건 필드에 근거합니다. 근거가 없는 항목은 “확인 필요”로 표시되며, 아이디어 탈취 여부를 단정하지 않습니다. 생성: local:rules-v1 · 3시간 전

공식 URL

https://www.dodsbirsttr.mil/topics-app/

신청 URL

https://www.dodsbirsttr.mil/topics-app/

최종 수집

2026.08.20

담당자 검수

미검수 (공고 원문 확인 권장)

최초 수집

2026.08.20

데이터 상태

자동 수집 (미검수)

AI 보강

local:rules-v1 · 3시간 전