CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
Overview
What you need to judge this in 30 seconds
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturi
- Category
- R&D
- Industry
- Manufacturing, Construction & Proptech, Chemicals & Materials, Semiconductor
- Technology
- Semiconductor, Advanced Materials
- Target stage
- Needs verification
- Project duration
- Needs verification
- Estimated preparation
- Needs verification
Funding
Award size and how it is paid
- Award range
- Needs verification
- Currency
- USD
- Total programme budget
- Needs verification
- Support type
- Cash
- Co-funding
- None (fully funded)
- Matching fund
- Needs verification
- Disbursement
- Needs verification
- Note
- -
Eligibility
Can we actually apply?
An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
- Company age
- Needs verification
- Employees
- Needs verification
- Revenue limits
- Needs verification
- Consortium
- Needs verification
Location Requirements
Geography and legal-entity conditions
- Primary country
- 🇺🇸 United States
- Also eligible
- None
- Foreign companies
- Needs verification
- Local entity
- Needs verification
- Location condition
- A US federal programme: the applicant must be an eligible entity based in the United States.
Required Documents
Required/optional · issuer · difficulty · validity · cautions
Document requirements were not captured (needs verification). Check the official announcement.
Application Process
How you apply
Application process not captured.
Evaluation
Review process and criteria
Evaluation process not captured.
Timeline
Announcement → intake → review → agreement → execution
Process steps were not captured.
Equity & Financial Terms
Equity, loans and contract conditions
- Equity required
- Needs verification
- Loan
- Non-dilutive grant
- Duplicate funding
- Needs verification
- IP ownership
- Needs verification
- Deliverable ownership
- Needs verification
- Exclusivity
- Needs verification
- Right of first refusal
- Needs verification
- Audit & settlement
- Needs verification
- Bayh-Dole government licence
US federal R&D funding commonly carries a government licence clause.
Source: Standard across grants.gov federal programmes — check the individual announcement.
Risk Intelligence
Should we apply at all? — five dimensions plus an overall score (lower is safer)
No risk assessment yet. Re-analyse from Admin.
IP / Idea Protection
How much of your technology and idea you must disclose
No IP assessment yet.
AI Analysis
Pros · cons · difficulty · competition · attractiveness
From paperwork and review stages
Heuristic from award size and type
Amount, terms and IP combined
Weighted average of five dimensions
- Needs verification
- Needs verification
- Nothing flagged
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Source & Provenance
Every value carries its source URL and fetch time
- Application URL
- https://www.grants.gov/search-results-detail/350338
- Last fetched
- 2026.08.16
- Human review
- Not reviewed — check the official announcement
- First seen
- 2026.08.16
- Data status
- Auto-collected, not reviewed
- AI enrichment
- Needs verification
- PRIMARYGrants.gov 2023-NIST-CHIPS-SMME-01
Fetched 3h ago
- OFFICIAL_APIGrants.gov Search2 API
Fetched 3h ago
- · 3h ago — 최초 수집 (05d71f99)